XPETG ESD
XPETG ESD has been specially developed for the production of antistatic objects for
developed electronic components. Through a stored deposit and then
Diffusion to the surface creates the ESD property.
Advantage of this technology is in contrast to conductive carbon no abrasion (fine dust)
& white material.
The material has high electric charge dissipation properties that ensure safety
integrated circuits and other components ensure and risk
minimize partial or permanent damage.
- Surface resistance 6.3x10^8 ohms
- Max charge 0.2kV
- HHalf-life < 0.5sec
Maximum load
PETG has a very high mechanical resilience.
elongation at break
PETG is characterized by high flexibility combined with good rigidity.
heat resistance
A heat resistance of 80-90 °C allows the use in many
Areas from the production of electronic components to kitchen utensils.
difficulty level
PETG is suitable for slightly advanced users, especially for large ones
components (over 10x10x10 cm) a heating bed and a closed construction
space is recommended.
visual quality
The material has a glassy look and is available in intense colors.
layer liability
Layer adhesion is excellent with sufficient heat and low cooling.
impact resistance
The material has very good impact resistance.
Speed: 40-60mm/s
Printing Temperature: 220-230℃
Heated bed temperature: 60-70 °C
XPETG ESD ESD
